DPL-24
- Microprocessor driven programmable controller
- Fully adjustable Pressure Dwell
- Independant upper and lower digitally adjustable heat platens
- Evacuation, heat, and pressure are combined for voidless lamination
- Fully adjustable Pressure Dwell
- Independant upper and lower digitally adjustable heat platens
- Evacuation, heat, and pressure are combined for voidless lamination
Differential Pressure Laminator
Vacuum Lamination of high-tech products has seen explosive growth in the last decade. Until now no system offered the level of vacuum, coupled with the use of positive pressure, that the DPL-24 Differential Pressure Laminator provides.
No pressure is applied to the lamination sandwich during the Vacuum Dwell therefore maximum evacuation is assured. During the Pressure Dwell, a flexible diaphragm compresses and encapsulates the product and true Isostatic lamination is achieved.
These features open the door for many new and exciting applications and clearly position the DPL-24 as the most technologically advanced device of its kind... with a cost/benefit ratio sure to please the most demanding purchaser.
Theory of Operation
The DPL-24 Differential Pressure Laminator has been designed to give the operator a flexible method for laminating sheet supported emulsions onto a variety of substrates. These substrates, pre-laminated either manually or with the assistance of currently available dispensing equipment, are placed on the slide mounted platen and positioned in the chamber. Substrates varying in thickness and geometry may be intermixed to increase throughput.
The fully automated cycle is activated from the front panel and controlled by a microprocessor driven Programmable Controller. Utilizing a high vacuum (42 CFM), rotary vane pump, a vacuum end point below 2 Torr is achieved. This vacuum is displayed on a computer calibrated digital gauge located on the front panel. The substrate is exposed to this Vacuum Dwell for a time determined by a precision digital timer that is adjustable from .1 seconds to infinity.
Following this period, a preheated silicone rubber diaphragm descends onto the workpiece. This action closes the small gap below the spring-mounted platen assembly and provides direct thermal contact with the lower heat platen. The temperatures of both the upper and lower Heated Platens are controlled independently by microprocessor based Temperature Controllers.
Unlike conventional Vacuum Laminators, the DPL-24 permits the addition of positive pressure above the diaphragm, increasing the effective lamination pressure dramatically. The Pressure Dwell period is adjusted with a timer identical to that employed in the Vacuum Dwell.
Upon completion of a cycle, the drawer mechanism is retracted and the products are removed for further processing.
Vacuum Lamination of high-tech products has seen explosive growth in the last decade. Until now no system offered the level of vacuum, coupled with the use of positive pressure, that the DPL-24 Differential Pressure Laminator provides.
No pressure is applied to the lamination sandwich during the Vacuum Dwell therefore maximum evacuation is assured. During the Pressure Dwell, a flexible diaphragm compresses and encapsulates the product and true Isostatic lamination is achieved.
These features open the door for many new and exciting applications and clearly position the DPL-24 as the most technologically advanced device of its kind... with a cost/benefit ratio sure to please the most demanding purchaser.
Theory of Operation
The DPL-24 Differential Pressure Laminator has been designed to give the operator a flexible method for laminating sheet supported emulsions onto a variety of substrates. These substrates, pre-laminated either manually or with the assistance of currently available dispensing equipment, are placed on the slide mounted platen and positioned in the chamber. Substrates varying in thickness and geometry may be intermixed to increase throughput.
The fully automated cycle is activated from the front panel and controlled by a microprocessor driven Programmable Controller. Utilizing a high vacuum (42 CFM), rotary vane pump, a vacuum end point below 2 Torr is achieved. This vacuum is displayed on a computer calibrated digital gauge located on the front panel. The substrate is exposed to this Vacuum Dwell for a time determined by a precision digital timer that is adjustable from .1 seconds to infinity.
Following this period, a preheated silicone rubber diaphragm descends onto the workpiece. This action closes the small gap below the spring-mounted platen assembly and provides direct thermal contact with the lower heat platen. The temperatures of both the upper and lower Heated Platens are controlled independently by microprocessor based Temperature Controllers.
Unlike conventional Vacuum Laminators, the DPL-24 permits the addition of positive pressure above the diaphragm, increasing the effective lamination pressure dramatically. The Pressure Dwell period is adjusted with a timer identical to that employed in the Vacuum Dwell.
Upon completion of a cycle, the drawer mechanism is retracted and the products are removed for further processing.
DPL-24 - Features at a Glance
Differential Pressure Lamination is a process to adhere one thin flexible material to another material of varying thickness.
Evacuation, heat, and pressure are combined in one process to provide an airless environment where complete adhesion is assured.
The vacuum is displayed on a thermocouple sensing, computer calibrated, digital gauge located on the front panel.
The substrate is exposed to this Vacuum Dwell for a time determined by a precision digital timer.
At the end of the Vacuum Dwell, a preheated silicone rubber diaphragm descends onto the work-piece and drives the spring-mounted drawer mechanism into intimate contact with the lower heater platen.
The temperatures of both the upper and lower heat platens are controlled independently by digital, proportional, Temperature Controllers.
A positive pressure of up to 10 PSI is applied to the top of the diaphragm to bring the combined differential to nearly 25 PSI.
The Pressure Dwell is adjusted by a precision digital timer identical to that employed by the Vacuum Dwell.
Upon completion of a cycle, the drawer mechanism is retracted and the product is removed for further processing.
The entire process is governed by a microprocessor driven programmable controller.
Programming modifications are available from the factory.
Differential Pressure Lamination is a process to adhere one thin flexible material to another material of varying thickness. Evacuation, heat, and pressure are combined in one process to provide an airless environment where complete adhesion is assured. The vacuum is displayed on a thermocouple sensing, computer calibrated, digital gauge located on the front panel. The substrate is exposed to this Vacuum Dwell for a time determined by a precision digital timer. At the end of the Vacuum Dwell, a preheated silicone rubber diaphragm descends onto the work-piece and drives the spring-mounted drawer mechanism into intimate contact with the lower heater platen. The temperatures of both the upper and lower heat platens are controlled independently by digital, proportional, Temperature Controllers. A positive pressure of up to 10 PSI is applied to the top of the diaphragm to bring the combined differential to nearly 25 PSI. The Pressure Dwell is adjusted by a precision digital timer identical to that employed by the Vacuum Dwell. Upon completion of a cycle, the drawer mechanism is retracted and the product is removed for further processing. The entire process is governed by a microprocessor driven programmable controller. Programming modifications are available from the factory.
Detailed Specifications -View Printable PDF
| Model | DPL-24 |
| Substrate Size | Up to 24" X 24" on a standard machine.Smaller sizes can be processed in multiples to increase throughput and can be intermixed with substrates of differing geometries. |
| Substrate Thickness | Thicknesses from .001" to .375" can be accommodated though standard tooling is designed for a maximum height of .150". |
| Shipping Weight | 2200 Lbs. |
| Dimensions | 44" Wide X 44" Deep X 60" High |
| Utilities | 220 VAC, 40 Amps/phase, 3 Phase 50/60Hz Dry air at 5.5 Bar (80 PSI), 142 L/m (5 CFM) |
| Vacuum | An end point in excess of 2 Torr. |
| Timers | Independent, Digital, "Vacuum" and "Pressure" Timers with LCD elapsed time indicators. |
| Productivity | Cycle time is adjustable from 5 Seconds to Infinity and is determined by application parameters such as product complexity, topography, exit temperature, etc. A typical time for a film application is less than one minute (30 seconds/Vacuum Dwell and 20 seconds/Pressure Dwell). |
| OPTEK is committed to continuous improvement. Specifications are subject to change. | |
Applications
Initially conceived for laminating films onto printed circuit boards, new applications are being developed at a steady rate. Among them are:
Lamination of Film Mask to BGA and micro BGA products.
Lamination of Primary Imaging Film onto 3-Dimensional Surfaces.
Evacuation of Liquid Photo-Imageable Solder Mask.
Lamination of Dielectric Coating in Preparation for the Screening of Additional Circuitry.
Application of tape-supported strippable encapsulant for chip-scale interconnect processing.
Lamination of pressure-sensitive adhesives to glass and other substrates for flat panel displays.
Application of Coatings for Multi-wire Boards.
In addition, tests are being conducted which will permit the use of the DPL as the first high vacuum, single cavity, isostatic, multilayer press on the market.
The latest technological developments in the industry, coupled with a massively constructed vacuum vessel, assure the purchaser of many years of trouble-free operation.
Initially conceived for laminating films onto printed circuit boards, new applications are being developed at a steady rate. Among them are:
Lamination of Film Mask to BGA and micro BGA products. Lamination of Primary Imaging Film onto 3-Dimensional Surfaces. Evacuation of Liquid Photo-Imageable Solder Mask. Lamination of Dielectric Coating in Preparation for the Screening of Additional Circuitry. Application of tape-supported strippable encapsulant for chip-scale interconnect processing. Lamination of pressure-sensitive adhesives to glass and other substrates for flat panel displays. Application of Coatings for Multi-wire Boards.In addition, tests are being conducted which will permit the use of the DPL as the first high vacuum, single cavity, isostatic, multilayer press on the market.
The latest technological developments in the industry, coupled with a massively constructed vacuum vessel, assure the purchaser of many years of trouble-free operation.
